Substrate Design Augmentation for Die Placement Reference at Die Attach Process
نویسندگان
چکیده
منابع مشابه
Printable Die Attach Adhesives for Substrate-On-Chip Packaging
The dominant trend in packaging DDR DRAM for the future is the face down substrate-on-chip configuration. For this type of package it is critical that the die attach method employed provide precise control of bond line thickness and die tilt, minimal fillet, and prevent contamination of the wire bond pads located on the edge of the center wire bond channel. To date, a film adhesive has been the...
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ژورنال
عنوان ژورنال: Journal of Engineering Research and Reports
سال: 2021
ISSN: 2582-2926
DOI: 10.9734/jerr/2021/v20i817355